@article{yjycl2108474132754464769,
  title = {基于SYSWELD软件T型接头焊接温度场的数值模拟分析},
  author = {陈俊安 and 崔建峰 and 李峰超 and 王乐 and 赵宏伟},
  journal = {冶金与材料},
  year = {2020},
  number = {5},
  pages = {131--132},
  issn = {2096-4854},
  url = {https://journal.zazhitong.com/yjycl/articles/2108474132754464769},
}